This high data rate 12Gbps photodiode chip is GaAs top- illuminated PIN structure. Features is high responsibility, low capacitance, low dark current, active area size is Φ60μm, anode and cathode bond pad on top for TO-CAN package wire-bond, application in fiber channel data transmission.
Features
Applications
© 2024 PHOGRAIN Technology(Shenzhen)Co.,Ltd