4X10Gbps Φ70μm 250μm Die Pitch 1X4 Array GaAs PIN PD Chip

This high data rate 4X10Gbps photodiode chip is GaAs top- illuminated PIN structure. Features is high responsibility, low capacitance, low dark current, active area size is Φ70μm, anode and cathode bond pad on top for TO-CAN package wire-bond, application in fiber channel data transmission, 10Gigabit Ethernet and Multi-mode communication etc.

Features

1. Φ70μm active area.
2. Low capacitance and low dark current.
3. High responsibility.
4. Data rate up to 10Gbps.
5. Die pitch: 250μm
6. Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
7. 100% testing and inspection.

Applications

1. 10Gbps AOC (Active Optical Cable) receiver at 850nm.
2. Infiniband.
3. SONET/SDH